Non-Uniform Interconnect Temperature-Driven Buffer Insertion
نویسندگان
چکیده
This paper presents the analysis and modeling of the effects of non-uniform substrate temperature in high performance ICs on the buffer insertion technique. Using a non-uniform temperaturedependent distributed RC interconnect delay model, the optimum buffer insertion in the interconnects is analyzed and some design guidelines are provided to ensure the near-optimality of the signal performance in the presence of thermal gradients in the global interconnects. Experimental results show that neglecting such gradients in the wires results in non-optimal signal delays under standard buffer insertion scheme and that these effects increase with scaling.
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